355nm Laser Depaneling Machine Digital PLC Control

Laser pcb separator
September 28, 2021
Category Connection: レーザーDepaneling機械
Brief: Discover the 355nm Laser Depaneling Machine with Digital PLC Control, designed for precision PCB and FPC board separation. This optional PCB laser separator machine, exported to Vietnam, offers advanced laser technology for clean, distortion-free cutting with high-speed processing and minimal thermal stress.
Related Product Features:
  • The laser process is completely software-controlled, eliminating retooling times for varying materials or cutting contours.
  • No appreciable mechanical or thermal stresses, allowing precise processing of sensitive substrates.
  • The laser beam requires only a few µm as a cutting channel, enabling more components per panel.
  • LPKF CleanCut technology ensures clean and distortion-free cutting channels, setting industry benchmarks.
  • Double worktables improve production capacity with alternate operation.
  • Extended worktable design ensures convenient and safe product handling.
  • Compatible with multiple lasers for easy follow-up maintenance.
  • Vision of laser and camera is concentric, simplifying debugging and programming.
よくある質問:
  • What are the key advantages of using laser technology for PCB depaneling?
    Laser technology offers software-controlled processing, no mechanical or thermal stress, minimal cutting channels, and clean, distortion-free cuts with LPKF CleanCut technology.
  • What is the cutting precision of the 355nm Laser Depaneling Machine?
    The machine offers a cutting precision of 0.03mm, ensuring high accuracy for PCB and FPC board separation.
  • What industries can benefit from this PCB laser separator machine?
    Industries such as PCB, FPC, medical equipment, automation, LED, and mobile phone manufacturing can benefit from this machine's precision and efficiency.